Phytophusion BOND REPAIR Conditioner
Water, Cetearyl Alcohol, Glycerin, Dimethicone, Behentrimonium Chloride, Parfum/Fragrance, Cetrimonium Bromide, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Helianthus Annuus Seed Extract, Chamomilla Recutita Flower Extract, Simmondsia Chinensis Seed Oil, Aloe Barbadensis Leaf Juice, Glycol Distearate, Malpighia Glabra Fruit Extract, Cocos Nucifera Oil, Stearalkonium Chloride, Argania Spinosa Kernel Oil, Persea Gratissima Oil, Trisodium Ethylenediamine Disuccinate, Polyquaternium-7, Phenoxyethanol, Isopropyl Alcohol, Ethylhexylglycerin, Lactic Acid, Butylene Glycol, Aminomethyl Propanol, Limonene, Coumarin